• At spintronicsAI with extensive research we will build data models wrt to your product requirements and schedule constraints.
• These Data models help in exploring trade offs between business, financial and technical constraints for achieving right TTM
• Detailed algorithms will be built for tracking every stage of implementation and signoff
• With multiple handoffs our custom flows will ensure the quality of the design is maintained throughout the design cycle
• Custom built signoff flows will ensure quality checklist from customer is met and ensure design is ready for next stage of implementation.

• Standard Cell
• High Density, High Speed, Low power
• Design, Layout and Characterization
• Analog and Mixed Signal
• ADC, DAC, Regulator, PLL, DLL, Transmitter (TX), Receiver (RX)
• High-Speed Serdes, DDR,  other PHY Interfaces, USB, Die-to-Die etc
• Post Layout Extraction (PEX) Simulation and Verification
• Physical Verifications (ANT, DRC, DFM, LVS, ERC, PAD, PERC, ESD/Latch-up, EMIR/SHE etc)
• Memory, IO PAD Library Design & Simulation, AMS Verification
• Block level, IP level and Chip level Layout      

RTL Design and Integration

• Design Implementation
• Translating power spec to UPF
• Design and UPF validation
• LINT and CDC checks
• RTL Handoff 

Verification

• Verification Service for ASIC, SOC and FPGA Design
• VMM, OVM, UVM, RVM, eRM methodology based verification
• Intellectual Property Verification
• Verification Assessment
• Verification Planning
• Verification Environment Development using bus functional models, monitors, checkers,
  test pattern/packet generator and score boards
• Functional verification